Skip to content
  • Home
  • Materials
    • ALD/CVD
    • CMP
    • PHOTORESISTS
    • PACKAGING MATERIALS
    • EQP COMPONENT
    • GASES
    • SILICON WAFERS
    • SILICON CARBIDE
    • TARGETS
    • WET CHEM
    • METAL/MINERAL/RARE EARTHS
    • WILD TECH
    • LIST ALL
    • Email Preferences for Materials Updates
  • Fabs/OEM
  • Global Trends
    • REGIONAL NEWS
    • LOGISTICS/TRADE
    • ECONOMIC NEWS/ TRENDS
  • TECHCET/CMC
    • TECHCET Website
    • CMC Website
  • TECHCET News
    • 2023- TECHCET News
    • 2022 – TECHCET News
    • 2021 – TECHCET-News
    • 2020 – TECHCET News
    • 2019 – TECHCET News
    • 2018 – TECHCET News
    • Advisory Alerts
      • Advisory Alert August 2022
      • Advisory Alert Nov 2022
  • About Us
  • Contact Us
  • Languages
    • Chinese (simplified)
    • Chinese/Taiwan (traditional)
    • French
    • German
    • Italian
    • Korean
  • Log in
22 Mar, 2023
Latest News
Biden-Harris Administration Launches First CHIPS for America Funding Opportunity
Merck and Intel Accelerate Sustainable Semiconductor Processes and Manufacturing Technologies.
US will create at least two semi manufacturing cluster by 2030
Critical Materials Council

  • Home
  • Materials
    • ALD/CVD
    • CMP
    • PHOTORESISTS
    • PACKAGING MATERIALS
    • EQP COMPONENT
    • GASES
    • SILICON WAFERS
    • SILICON CARBIDE
    • TARGETS
    • WET CHEM
    • METAL/MINERAL/RARE EARTHS
    • WILD TECH
    • LIST ALL
    • Email Preferences for Materials Updates
  • Fabs/OEM
  • Global Trends
    • REGIONAL NEWS
    • LOGISTICS/TRADE
    • ECONOMIC NEWS/ TRENDS
  • TECHCET/CMC
    • TECHCET Website
    • CMC Website
  • TECHCET News
    • 2023- TECHCET News
    • 2022 – TECHCET News
    • 2021 – TECHCET-News
    • 2020 – TECHCET News
    • 2019 – TECHCET News
    • 2018 – TECHCET News
    • Advisory Alerts
      • Advisory Alert August 2022
      • Advisory Alert Nov 2022
  • About Us
  • Contact Us
  • Languages
    • Chinese (simplified)
    • Chinese/Taiwan (traditional)
    • French
    • German
    • Italian
    • Korean
  • Log in
  • Home
  • Uncategorized
  • Solar Applied Materials Technology Co to invest NT$1 billion (US$34.1 million) to build a new plant at the Tainan Technology Industrial Park

Solar Applied Materials Technology Co to invest NT$1 billion (US$34.1 million) to build a new plant at the Tainan Technology Industrial Park

September 24, 2020September 24, 2020 Dan Tracy
This content is for members only.
Login Here
Sputtering Targets Alerts, Uncategorized

Post navigation

Previous Previous post: TSMC considers expanding factory site in central Taiwan
Next Next post: Gas, Messer – Messer to construct EUR 35 million (USD 41 million) ASU in Spain – the new production plant will have a capacity of 2,400 tonnes of oxygen, nitrogen and argon per day.

Upcoming Events

View All Events

Recent Posts

  • Biden-Harris Administration Launches First CHIPS for America Funding Opportunity
  • Merck and Intel Accelerate Sustainable Semiconductor Processes and Manufacturing Technologies.
  • US will create at least two semi manufacturing cluster by 2030
  • CHIPS Act will strengthen US national security by boosting access to semiconductors: Raimondo
  • U.S. Department of Commerce Announces CHIPS for America Leaders and Staff
  • Updates on CHIPS Manufacturing Incentives and R&D
  • Intel Dalian
CMC Fabs is a unit of TECHCET CA LLC, a firm focused on Process Materials Supply Chains, Electronic Materials Technology, Materials Market Research and Consulting for the Semiconductor, Display, Solar/PV, and LED Industries.
© 2020 TECHCET All Rights Reserved
Magazine Plus by WEN Themes