Skip to content
  • Home
  • Materials
    • ALD/CVD
    • CMP
    • PHOTORESISTS
    • PACKAGING MATERIALS
    • EQP COMPONENT
    • GASES
    • SILICON WAFERS
    • SILICON CARBIDE
    • TARGETS
    • WET CHEM
    • METAL/MINERAL/RARE EARTHS
    • WILD TECH
    • LIST ALL
  • Fabs/OEM
  • Global Trends
    • REGIONAL NEWS
    • LOGISTICS/TRADE
    • ECONOMIC NEWS/ TRENDS
  • TECHCET/CMC
    • TECHCET Website
    • CMC Website
  • TECHCET News
    • 2022 – TECHCET News
    • 2021 – TECHCET-News
    • 2020 – TECHCET News
    • 2019 – TECHCET News
    • 2018 – TECHCET News
    • Advisory Alerts
      • Advisory Alert – Featuring TSMS & INTEL – August 2021
  • About Us
  • Contact Us
  • Languages
    • Chinese (simplified)
    • Chinese/Taiwan (traditional)
    • French
    • German
    • Italian
    • Korean
  • Log in
26 May, 2022
Latest News
How Do We Produce Future Green Technology Without Damaging Seabeds?
TechInsights Inc. announce the acquisition of The Linley Group, Inc
Sony Buys GAA Patents from Intel
Critical Materials Council

  • Home
  • Materials
    • ALD/CVD
    • CMP
    • PHOTORESISTS
    • PACKAGING MATERIALS
    • EQP COMPONENT
    • GASES
    • SILICON WAFERS
    • SILICON CARBIDE
    • TARGETS
    • WET CHEM
    • METAL/MINERAL/RARE EARTHS
    • WILD TECH
    • LIST ALL
  • Fabs/OEM
  • Global Trends
    • REGIONAL NEWS
    • LOGISTICS/TRADE
    • ECONOMIC NEWS/ TRENDS
  • TECHCET/CMC
    • TECHCET Website
    • CMC Website
  • TECHCET News
    • 2022 – TECHCET News
    • 2021 – TECHCET-News
    • 2020 – TECHCET News
    • 2019 – TECHCET News
    • 2018 – TECHCET News
    • Advisory Alerts
      • Advisory Alert – Featuring TSMS & INTEL – August 2021
  • About Us
  • Contact Us
  • Languages
    • Chinese (simplified)
    • Chinese/Taiwan (traditional)
    • French
    • German
    • Italian
    • Korean
  • Log in
  • Home
  • Device Technology
  • PCM + ReRAM = OUM in XPoint

PCM + ReRAM = OUM in XPoint

June 23, 2017September 2, 2021 CritMat Admin
This content is for members only.
Login Here
Device Technology, Fab Technologyarchitecture, array, chalcogenide, cross-bar, device, fab, glass, HDD buffer, history, HVM, Intel, manufacturing, material, memory, Micron, NVM, Optane, OTS, OUM, ovonic, Ovonyx, PCM, phase, production, R&D, ReRAM, resistance, SSD, storage class, switch, XPoint

Post navigation

Previous Previous post: Umicore launches superior TMGa & TEGa production
Next Next post: Analyst Alert from Mike Walden – Episil Reportedly Planning to Increase Epi Wafer Pricing

Upcoming Events

CMC Fabs- Monthly Meeting
Thursday, June 9, 2022
CMC Fabs- Monthly Meeting
Thursday, July 14, 2022
CMC Fabs- Monthly Meeting
Thursday, August 11, 2022
Advisory Alert Webinar
Wednesday, August 17, 2022
View All Events

Recent Posts

  • How Do We Produce Future Green Technology Without Damaging Seabeds?
  • TechInsights Inc. announce the acquisition of The Linley Group, Inc
  • Sony Buys GAA Patents from Intel
  • Cement maker promises to speed up EV battery charge times
  • Imec, Belgium, just reached a major milestone for high-NA (0.55 NA) EUV lithography
  • Globalfoundries US has been awarded USD 400 M Defense Contracts
  • Cobalt, EV – Tesla to roll out China-made Model 3 cars with cobalt-free LFP batteries
CMC Fabs is a unit of TECHCET CA LLC, a firm focused on Process Materials Supply Chains, Electronic Materials Technology, Materials Market Research and Consulting for the Semiconductor, Display, Solar/PV, and LED Industries.
© 2020 TECHCET All Rights Reserved
Magazine Plus by WEN Themes